GOAL:
Simulate Evolution of 3D Chip Features
During The Manufacturing Process
Existing 2D and 3D Codes:
- Neureuther: SAMPLE-3D
- McVittie: SPEEDIE
- Cale: EVOLVE
- Sethian: Level Set Method
- Hamaguchi, IBM: 2D Front Tracking
- AMS: Front Tracking
Distinguishing Feature: Treatment of Cusps and Corners
MACRO PHYSICS
Model Data:
- Source Models:
Point, Line, and Area Source
- Etching/Deposition Yields:
- Material Properties
- Surface Orientation
- Resputtering Model
- Sticking Probabilities
Data Sources:
Hamilton-Jacobi Model for
Surface of Chip:
3D Surface Evolution Issues:
- Cusp Formation
- De looping
- Resputtering
- View Factors
- Admissible Solutions at Cusps and Corners(?)
-
Surface Diffusion (assumed small) Selects Physical Solution!!
- Nonlocal De looping